With shrinking of chip sizes, Wafer Level Chip Scale Packaging (WLCSP) becomes an attractive and holistic packaging solutions with various advantages in comparison to conventional packages, such as ...

Semiconductor makers STMicroelectronics and Infineon have teamed with 3D packaging provider STATS ChipPAC to jointly develop the next generation of embedded Wafer-Level Ball Grid Array (eWLB) ...

STATS ChipPAC has expanded the embedded wafer-level ball-grid array (eWLB) technology to reconstituted 300mm wafers, according to the company. By adding capacity through 300mm wafer manufacturing, ...

STATS ChipPAC has shipped over one billion fan-out wafer level packages (FOWLP), also known in the industry as embedded wafer-level ball grid array (eWLB), according to the company. Save my User ID ...

STMicroelectronics, STATS ChipPAC, and Infineon Technologies have agreed to jointly develop the next generation of embedded wafer-level ball-grid array (eWLB) technology. The R&D effort will focus on ...

SAN JOSE, Calif. – STATS ChipPAC Ltd. recently celebrated the grand opening of its new 300-mm embedded wafer-level ball grid array (eWLB) manufacturing facility. The official inauguration was recently ...

The emergence and evolution of any package technology is driven by market trends as experienced by the end application. With the maturation of the mobile market, the trends for Smartphone and other ...

MUNICH, Germany — Infineon has granted licenses for its eWLB chip packaging technology to competitor STMicroelectroncis as well as to Singapore-based packaging engineering company STATS ChipPAC. The ...