CEA-Leti and STMicroelectronics have outlined a method that could push RF modules towards full monolithic integration on ...

India, Vietnam, and South Korea will be the most dynamic global growth markets for UK tech companies in 2026, according to a ...

Marvell has announced that a range of AI and data-centre equipment makers have adopted its latest generation of PCIe retimers ...

MVTec and Qualcomm enable customers of MVTec HALCON software to access Qualcomm Dragonwing processors’ high-performance NPUs ...

Renesas' RA6W1 dual-band Wi-Fi 6 wireless MCU along with the RA6W2 MCU integrates both Wi-Fi 6 and Bluetooth LE technologies ...

AI-driven workloads are transforming the performance and efficiency requirements of embedded infrastructure systems.

Molex introduces MX-DaSH modular wire-to-wire connectors, the newest additions to its MX-DaSH family of data-signal hybrid ...

EMASS announced a strategic collaboration with Semtech to bring low-power Edge AI solutions integrated with LoRaWAN ...

ERC has awarded a Consolidator Grant for SuperQold project, focuses on scaling superconducting qubit readout with millikelvin (mK) detection.

Nissan Technical Centre Europe (NTCE) and Sonatus have announced a development partnership to accelerate the vehicle development process.

Kyocera and Rohde & Schwarz will showcase the characterisation of Kyocera’s novel phased array antenna module at CES 2026 in Las Vegas, NV.

Imec has demonstrated the first wafer-scale fabrication of solid-state nanopores using extreme ultraviolet (EUV) lithography.