As the industry advances into the angstrom era, gate-all-around architectures combined with atomic-scale materials ...
AI workloads are pushing the boundaries of compute, memory, and interconnect architectures, and to meet these goals, ...
A new technical paper “Mitigating hallucinations and omissions in LLMs for invertible problems: An application to hardware ...
CPC1056N, a compact, high-performance 60 V, 75 mA 1-Form-A solid-state relay (SSR) designed to meet the growing demand for ...
Abstract: Making and designing MOSFET transistors the traditional way has some serious issues. Engineers currently have to do a lot of manual labor and use crude estimates, and that usually results in ...
Abstract: This paper presents an approach, circuit under inductor (CUI), to reduce chip area as a solution for design technology co-optimization (DTCO) in sub-10-GHz RF and millimeter-wave (mmWave) ...