Abstract: Monolithic 3-D (M3D) integrated circuits (ICs) introduce a new aspect to the physical design problem by stacking dies vertically. We introduce a novel heterogeneous design for M3D ICs, which ...
Abstract: Direct bonding of InP active regions on a Si waveguide circuit is demonstrated using chip-on-wafer hydrophilic bonding process, and PL spectra from different epitaxial structures are ...
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