MIT electronics researchers develop a new way to fabricate transistors on the backend of finished dies, to keep pushing the limit of chip densities ever higher

Traditional CMOS chips are fabricated by applying and then etching repeated layers of different materials, applied to a wafer ...
Electronics For You

Ultra-Thin Materials Bring 3D Chips Closer

MIT’s prototype points to a future where chips move data millimeters less and save orders of magnitude more energy.
Nanowerk

Researchers find that a 'design limitation' in transistors actually improves performance

What many engineers once saw as a flaw in organic electronics could actually make these devices more stable and reliable, ...

How OpenAI is using GPT-5 Codex to improve the AI tool itself

In interviews with Ars Technica this week, OpenAI employees revealed the extent to which the company now relies on its own AI ...
Tech Xplore on MSN

First monolithic 3D chip built in U.S. foundry delivers major AI speed gains

A collaborative team has achieved the first monolithic 3D chip built in a U.S. foundry, delivering the densest 3D chip wiring ...
Cryptopolitan on MSN

ASML controls $1.4 trillion AI race, but can it keep up?

Christophe Fouquet, a French engineer who once took a demotion to learn chip-making technology, now runs ASML Holding NV, the ...
Solar Power World

Advanced silicone gels protect IGBT7 modules in PV inverters

PV inverters convert the direct current (DC) produced by solar panels into the alternating current (AC) used by homes and ...
Securities.io

Ultra-Thin Implanted Brain Computer Interface Breaks Records

BISC is an ultra-thin, single-chip brain-computer interface that sits between the brain and skull and uses 65,536 electrodes. The implant streams high-bandwidth neural data over a custom UWB link to a ...