Mindware Signs Agreement with Autodesk to Deliver Certified Training Programs - IT News Africa | Business Technology, ...

New partnership positions Mindware as an Autodesk Authorized Training Center (ATC) and accelerates workforce development in ...

Tata Advanced Systems Ltd (TASL), in collaboration with Spain’s engineering major Indra, has manufactured an advanced ‘3D Air Surveillance Radar (3D-ASR)‘ which has been commissioned on an Indian Navy ...

Inter-Die Gapfill Tool Expands Industry-Leading Portfolio of Solutions for 3D Integration and Chiplet Technologies; Paves Way for New, AI-Accelerating Architectures "VECTOR TEOS 3D deposits the ...

Inter-Die Gapfill Tool Expands Industry-Leading Portfolio of Solutions for 3D Integration and Chiplet Technologies; Paves Way for New, AI-Accelerating Architectures Addresses Manufacturing Pain ...

To break through the technical, mass production, and yield challenges in advanced packaging processes such as 3D IC and CoWoS, SEMI, together with TSMC and ASE Holdings, has established the "3DIC ...

As the industry transitions toward advanced 3D IC architectures and heterogeneous integration, managing thermo-mechanical stress is essential for product quality and long-term reliability. Calibre ...

Have you ever imagined turning your ideas into physical objects with just a few clicks? Thanks to tools like Tinkercad, what once seemed like science fiction is now an accessible reality for anyone ...

Advanced 3D cell models recreate the complexity of human tissues, enabling researchers to examine tumor progression, probe neurological disorders, and assess therapeutic candidates. By capturing the ...

As the semiconductor industry approaches a projected market value of $1 trillion by 2030, the transition from traditional monolithic architectures to modular chiplet-based designs represents a ...